Experience

IC Design:

RF blocks(LNA, PA, Mixer, Switches)

Mixed-Signal (DAC, ADC, OpAmps, Bandgaps, integer/Frac-N PLL)

Digital Circuitry (Filter, Receiver Algorithms, State-Machines, Serial Interfaces, Encoders, Decoders using Verilog HDL )

IC Layout and Verification

Top- down design verification approach for large mixed signal ICs using functional models.

Board Design:

Reference Board Design, Software and Drivers.

Generating Signal Integrity IBIS models from SPICE Simulations.

List of Completed Projects

Design verification and testing for RFID reader chip. Designed serial port, RFID Gen2 Decoder and FIFO, successfull real time FPGA verification, taped out ASIC version.

802.11 RF Blocks, Integer PLLs, Frac-N PLLs, DACs, LNAs, Mixers, PA Drivers, VCOs, Digital Filters.

RF Medical Devices.

IBIS Models.

Education

Master of Science in Electrical Engineering, Florida Atlantic University, Boca Raton, Florida

Bachelor’s degree in Electronics And Communications Engineering Institution of Engineers, India.

Software Tools

IC Design Software:

Agilent ADS (Linear/Nonlinear/Ptolemny)

Cadence DFII : Analog/RF Design Environment,

Agilent RFDE and Dynamic Link

Math programs and system simulator programs:

Matlab/Simulink

Xilinx System Generator

Synplify DSP

Digital design and verification programs:

Xilinx ISE

ModelSim

Layout Programs:

Cadence Virtuoso Layout Editor (IC Layout)

Cadsoft Eagle Layout Editor (Board Layout)

HDL Languages:

Verilog

VerilogA

Programming Languages:

Matlab

C/C++

Patents and Publications

US Patent:6285239, July 2000, Feed-Forward Biasing for RF Amplifiers II.

Microwave Journal, February 2000, A PA Driver for Split-Band Application.

RF Design magazine, June 1999, Improve efficiency of RF Power Amplifiers.

US Patent:6130579, March 1999, Feed-Forward Biasing for RF Amplifiers I.

US Patent:5723001, March 1998, Apparatus and method for therapeutically treating

human body tissue with electromagnetic radiation.

RF Design magazine, February 1997, Custom Control Software Tool for Smith charts.

A Titanium-dioxide Based Ceramic Composite Dispersed with Conducting
Inclusions as an EMI Shielding Material, Proc. 1993 IEEE International
Symposium EMC, August 9-13, 1993, Dallas, Texas.